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模块插座/插头

Part number： 95552-2887

Modular Jack, Vertical, Top Entry, Through Hole, 8/8, Int. Shielded, with Ribs, Tray

Product Consulting

Category:

垂直、顶部和底部接入

Keyword：模块插座/插头

Product Details

　图纸 (PDF)　　 3D模型 Product Literature (PDF)

一般

状态	Active
类别	模块插座/插头
系列	95552

一般

状态	Active
类别	模块插座/插头
系列	95552
注解	Reflow Capable, Inertnal Shield, Reflow Capable, Inertnal Shield
元件类型	PCB插孔
磁性的	否
概述	Magnetic and Modular Jacks and Plugs
性能分类	3
以太网电源(PoE)	N/A
Product Literature Order No	987650-8441
产品名称	Modular Jack 8/8, RJ45
UPC	800756696614

物理

衬套颜色	N/A
颜色-树脂	黑色
耐用性(插拔次数) - 最多次数	2500
向下 / 向上锁闩	否
Jack高度	16.25mm
光管/发光二极管	无
材料-金属	铜合金
材料-接合处电镀	金覆钯镍
材料-终端电镀	锡
材料-树脂	高温热塑型塑料
Net Weight	3.378/g
方向	垂直式(顶部接入)
PCB 保持力	是
PC厚度：推荐	1.57mm
包装形式	盘状
间距-接合界面	1.02mm
间距 - 终端界面	1.27mm
最薄镀层 - 接合部位	0.051µm, 1.016µm
最小镀层：端接	1.905µm
端口	1
位置 / 插入的接头	8/8
穿孔式表面焊接(SMC)	否
运行温度范围	-40° to +85°C
终端界面:类型	穿孔式
防水/防尘	否
导线/电缆型号	N/A

电气

(请核对产品规格的具体细节.)
每触点最大电流	1.5A
PCB接地	是
屏蔽的	是
电压 -最大	125V DC

焊接处理数据

Solderability Shelf Life Statement
Duration at Max. Process Temperature (seconds)	045
Lead-freeProcess Capability	WAVE
Max. Cycles at Max. Process Temperature	001
Process Temperature max. C	260

材料信息

参考：图纸编号

应用规范	AS-85513-001-001
产品规格	PS-95552-001-001
销售用图纸	SD-95552-001
测试总结	STR-1436-001

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