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PCB插座头


Part number: 200989-1010

图纸(PDF)  3DModel(PDF) 一般  状态Active类别PCB插座头系列200989应用板对板,Signal注解4.3AmpsperPolewithonly1contactpoweredup 1.4AmpsperPolewithmaxcontactspoweredup概述Slim-GridBoard-to-BoardConnectorsProductLiteratureOrderN

Category:

Keyword: PCB插座头

Product Details

 

 

 图纸 (PDF)  3D Model (PDF)
 

一般
 

 

状态 Active
类别 PCB插座头
系列 200989
应用 板对板, Signal
注解 4.3 Amps per Pole with only 1 contact powered up 

1.4 Amps per Pole with max contacts powered up
概述

Slim-Grid Board-to-Board Connectors

Product Literature Order No 987651-5972
产品名称 Slim-Grid
UPC 889056883023




物理
 

断开
电路数(已装入的) 10
电路数(最多的) 10
颜色-树脂 黑色
耐用性(插拔次数) - 最多次数 500
先接后断
阻燃性 94V-0
Glow-Wire Capable
可配插产品指南
插接极性
锁定插接部位
材料-金属 铜合金
材料-接合处电镀
材料-终端电镀 Matte Tin
材料-树脂 Liquid Crystal Polymer
Net Weight 0.359/g
行数 2
方向 垂直的
PCB 定位器
PCB 保持力
包装形式 管状
间距 - 终端界面 1.27mm
间距 - 终端界面 1.27mm
最薄镀层 - 接合部位 0.051µm
最小镀层:端接 2.000µm
有极性的插配件
PCB 极性
自动布局 提取和放置盖
有护墙的 全部
运行温度范围 -55° to +105°C
终端界面:类型 表面贴装

 


电气
 

每触点最大电流 1.4A
电压 -最大 125V AC


机构认证
 

CSA LR19980
UL E29179


焊接处理数据
 

Duration at Max. Process Temperature (seconds) 010
Lead-freeProcess Capability REFLOW
Max. Cycles at Max. Process Temperature 001
Process Temperature max. C 260

材料信息
 

参考:图纸编号
 

包装规格 2009890001-000
产品规格 2009890001-000
销售用图纸 2009890024-000

 

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